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Minerva Stomatologica 2010 May;59(5):253-8

Copyright © 2010 EDIZIONI MINERVA MEDICA

language: English

Temperature rise during adhesive and composite polymerization with different light-curing sources

Pereira Da Silva A. 1, Alves Da Cunha L. 1, Pagani C. 1, De Mello Rode S. 2

1 Department of Restorative Dentistry, UNESP - São Paulo State University, São José dos Campos, Brazil 2 Department of Dental Materials and Prosthesis, UNESP - São Paulo State University, São José dos Campos, Brazil


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AIM: This study evaluated the temperature rise of the adhesive system Single Bond (SB) and the composite resins Filtek Z350 flow (Z) and Filtek Supreme (S), when polymerized by light-emitting diode (LED XL 3000) and quartz-tungsten halogen (QTH Biolux).
METHODS: Class V cavities (3¥2 mm) were prepared in 80 bovine incisors under standardized conditions. The patients were divided as follows: G1: Control; G2: SB; G3: SB + Z; G4: SB + S. The groups were subdivided into two groups for polymerization (A: QTH, B: LED). Light curing was performed for 40 s and measurement of temperature changes during polymerization was performed with a thermocouple positioned inside the pulp chamber. Data were statistically analyzed using ANOVA and Tukey tests.
RESULTS: The factors material (P<0.00001) and curing unit (P<0.00001) had significant influence on temperature rise. The lowest temperature increase (0.15 °C) was recorded in G2 B and the highest was induced in G1 A (0.75 °C, P<0.05). In all groups, lower pulp chamber temperature measurements were obtained when using LED compared to QTH (P<0.05).
CONCLUSION: QTH caused greater increases in tooth temperature than LED. However, both sources did not increase pulpal temperature above the critical value that may cause pulpal damage.

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